Intel and Submer have announced a collaboration to co-develop the Precision Immersion Cooling Fluid Cloud for use in next-generation data centers. Intel and Submer are using Intel Xeon-based immersion-optimized server boards and Submer’s precision cooling technique to demonstrate the reuse of high-grade waste heat generated by compute elements in data centers. Intel and Submer’s collaboration will help accelerate industry standards for the adoption of immersion cooling.
Heat is considered a burden in current data center cooling implementations. It is removed and discarded, but with a process that impacts the environment and data center operating costs. The Precision Immersion Cooling Fluid Cloud concept uses liquid cooling to achieve the next level of efficiency and density, with the goal of reshaping the use of IT thermals by integrating a precision immersion cooling architecture within each node. This approach helps to ensure the generated high-grade heat can be easily reused, monetized or even leveraged to produce electricity while guaranteeing an optimal operating temperature for the processors and other components. This approach will eventually lead to eliminating cooling costs and unprecedented total cost of operations improvements, which convert today’s cooling burden into a benefit.