Western Digital and Samsung are out to standardize D2PF storage tech

April 7, 2022

Samsung and Western Digital have announced a memorandum of understanding (MOU) for a unique collaboration to standardize and drive broad adoption of next-generation data placement, processing and fabrics (D2PF) storage technologies. The companies will initially focus on aligning their efforts and creating a vigorous ecosystem for Zoned Storage solutions. These steps will enable the industry to focus on countless applications that ultimately create greater value for customers.

This marks the first time that both Samsung and Western Digital have come together as technology leaders to create widespread alignment and stimulate awareness for important storage technologies. Focusing on enterprise and cloud applications, the partnership is expected to spur a range of collaborations around technology standardization and software development for D2PF technologies like Zoned Storage. With this collaboration, end-users can have confidence that these emerging storage technologies will have support from multiple device vendors as well as from vertically integrated hardware and software companies.

The two companies have already kickstarted an initiative around Zoned Storage devices, including ZNS (Zoned Namespaces) SSDs and SMR (Shingled Magnetic Recording) HDDs. Through organizations such as SNIA (Storage Networking Industry Association) and the Linux Foundation, Samsung and Western Digital will define high-level models and frameworks for next-generation Zoned Storage technologies. With a commitment to enable open and scalable data center architectures, they have founded the Zoned Storage TWG (Technical Work Group), which was approved by SNIA in December 2021. The group is already defining and specifying common use cases for Zoned Storage devices, as well as host/device architecture and programming models.

In addition, this collaboration is expected to serve as a starting point to expand zone-based (e.g. ZNS, SMR) device interfaces, as well as future-generation, high-capacity storage devices with enhanced data placement and processing technologies. At a later stage, these initiatives will be expanded to include other emerging D2PF technologies such as computational storage and storage fabrics including NVMe over Fabrics (NVMe-oF)

by Anil George
Avid follower of all things tech. In between his quest for the ultimate gizmo, Anil fiddles with light meters, collects rare books and feeds his fetish for Jap horror movies. As Managing Editor of T3 Middle East for the GCC, Anil oversees content direction across print and digital. He was a CES 2020 Innovation Awards Judge, reprising his role as an Innovation Awards Judge at CES 2018, CES 2017, 2016 and 2015. Anil is also the Middle East's first Brand Ambassador for Ashdown Engineering. Reach him at: editor@t3me.com.